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3D integrated circuits become common

Reference judgmentLateDisputedResearch snapshot · October 15, 2026
Source confidence & research status
i
Editorial paraphrase · evidence v0.3. AI-assisted editorial assessments; original book editions not independently collated. Attribution and outcome confidence are recorded separately.

Source state: AUTHOR RETROSPECTIVE CHECKED.

Attribution confidence
MEDIUM
Outcome confidence · deadline / review
MEDIUM / MEDIUM
Timing confidence / kind
MEDIUM · EDITORIAL ERA BOUND
Population
Technology markets and relevant users; no universality unless the forecast expressly requires it.

Our reading of the claim

Reference (stated reasonable reading)

Late

Criterion: Multilayer active circuitry moves from experiments into ordinary semiconductor products.

Deadline: 2009 · Included in this comparison

At original deadlinePARTLY FULFILLED
By review dateFULFILLED

Early stacked/specialized devices made the direction real, but a broad transition to genuinely three-dimensional circuitry was only partial in 2009. Samsung’s mass-produced 3D V-NAND from 2013 establishes commercial multilayer circuits. The word “common” need not mean every processor has become 3D.

Deadline and follow-up notes

At deadline: Early stacked/specialized devices made the direction real, but a broad transition to genuinely three-dimensional circuitry was only partial in 2009.

By review: Samsung’s mass-produced 3D V-NAND from 2013 establishes commercial multilayer circuits. The word “common” need not mean every processor has become 3D.

Evidence: P01 (opens in a new tab)N12 (opens in a new tab)

View this reading in the scorecard →
01

The forecast and its attribution.

EDITORIAL PARAPHRASE

3D integrated circuits become common

How My Predictions Are Faring — Ray Kurzweil

1999 · Attribution / year unconfirmed
P01 printed p.27, Computers #19; P02 2009 computing section

AUTHOR RETROSPECTIVE REPRINT

Source publication: 2010-10 · Access: text checked

Official author archive. Cover says October 2010, but the available file contains later updates. Reprinted forecast passages are used for attribution; the author’s favorable self-grades are not independent outcome evidence. Original book editions were not inspected. Page locators below are PRINTED pages, not PDF viewer indices.

Catalogue entry P01
Open listed source (opens in a new tab)
Normalized claim
3D integrated circuits become common
Success criteria
Multilayer active circuitry moves from experiments into ordinary semiconductor products.
Claim type
Adoption
02

Timeline

PREDICTION MADE1999Attributed forecast year; original edition not collated
ORIGINAL TARGET2009Deadline supplied by this assessment
FULL REALIZATIONBy 2015Evidence bound, not first achievement year

EDITORIAL ERA BOUND: By the mid-2010s on the stated market reading; exact threshold year not established

End of named target year.

Outcome at original deadlinePARTLY FULFILLED
Outcome at reviewFULFILLED

Supplied target wording: 2009. The original deadline is preserved if a later forecast revises it. Forecast horizon: not established. Drift is a calendar-year difference, not a precise elapsed duration.

03

The evidence.

CONTEXT · Publication date not recorded

How My Predictions Are Faring — Ray Kurzweil (opens in a new tab)

Official author archive. Cover says October 2010, but the available file contains later updates. Reprinted forecast passages are used for attribution; the author’s favorable self-grades are not independent outcome evidence. Original book editions were not inspected. Page locators below are PRINTED pages, not PDF viewer indices.. Official author archive. Cover says October 2010, but the available file contains later updates. Reprinted forecast passages are used for attribution; the author’s favorable self-grades are not independent outcome evidence. Original book editions were not inspected. Page locators below are PRINTED pages, not PDF viewer indices.

Source checked as of 2026-10-15
AUTHOR RETROSPECTIVE REPRINT

Source publication: 2010-10 · Access: text checked

Official author archive. Cover says October 2010, but the available file contains later updates. Reprinted forecast passages are used for attribution; the author’s favorable self-grades are not independent outcome evidence. Original book editions were not inspected. Page locators below are PRINTED pages, not PDF viewer indices.

Catalogue entry P01
CONTEXT · 2013-08-06

Samsung begins mass production of 3D V-NAND (opens in a new tab)

Primary institutional, research, or issuer source. Dates in the claim refer to the observation or product event, not the review date.. Primary institutional, research, or issuer source. Dates in the claim refer to the observation or product event, not the review date.

Source checked as of 2026-10-15
PRIMARY RESEARCH OR OFFICIAL

Source publication: 2013-08-06 · Access: web text or indexed extract checked

Primary institutional, research, or issuer source. Dates in the claim refer to the observation or product event, not the review date.

Catalogue entry N12

Capability, adoption, and timing

A related breakthrough is not automatically fulfillment. Review must check the actual capability, how widely it was required to be used, the specified technology, and the original deadline. A prototype cannot establish a claim about routine or widespread use.

i
Alternative interpretation: 2015 is a conservative commercial-era bound, not a measured majority-market crossover. V-NAND is multilayer storage, not self-organizing molecular logic.
04

Research notes & history

2015 is a conservative commercial-era bound, not a measured majority-market crossover. V-NAND is multilayer storage, not self-organizing molecular logic.

Open questions

  • Original-edition collation remains an attribution task; it does not erase the stated outcome assessment.
  • An earlier documented instance could refine timing; the documented-by date is not claimed to be the invention year.
Imported from
kurzweil_verification_v0_3_package/predictions.canonical.v0.3.json
Legacy identifier
None
Forecast family
K051
Parent statement
Not assigned
File checksum
93ae54d9ea2f1bd1817c481b85e2b707812bcd934c74d0f1715fa098d9b5f51b
Inspect preserved source fields
release_record
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Review history

— Evidence v0.3: EDITORIAL_ASSESSMENT_COMPLETE; supplied verdict LATE. Early stacked/specialized devices made the direction real, but a broad transition to genuinely three-dimensional circuitry was only partial in 2009. Samsung’s mass-produced 3D V-NAND from 2013 establishes commercial multilayer circuits. The word “common” need not mean every processor has become 3D.

Related forecasts.

No forecast family has been resolved for this record. Related statements and revised deadlines will be linked during research.